The GIGABYTE B560M AORUS PRO AX Wi-Fi Intel 10th and 11th Gen ATX Motherboard uses a 12+1 phases digital CPU power design which includes both digital PWM Controller and DrMOS. These 100% digital controller and additional 8 Solid-pin CPU Power Connectors offer incredible precision in delivering power to the motherboard's most power-hungry and energy-sensitive components, allowing enthusiasts to get the absolute maximum performance from the new Intel 11th Gen CPU. GIGABYTE B560M AORUS PRO AX Wi-Fi 11th Gen Motherboard B560M AORUS uses high performance Fully Covered thermal design with high coverage MOSFET Heatsinks and thick thermal pad, providing ultimate MOSFET cooling performance for enthusiasts, overclockers and gamers. With the best quality components and GIGABYTE R&D design capability, the B560M AORUS is a true beast among motherboards. Delivers high-quality sound resolution and sound expansion to create the most realistic sound effects for professional gamers. The motherboard features RGB FUSION 2.0 and offers users the option to control onboard, external light strips, and/or AORUS devices with RGB/ Addressable RGB LEDs to make their PC more unique and stylish. GIGABYTE is reputable for its product durability and high-quality manufacturing process. Needless to say, we use the best components we can find for the B560M AORUS motherboard and reinforce every slot to make each of them solid and durable. Good software goes hand in hand with perfect hardware. GIGABYTE motherboard bundled several useful and intuitive software to help users to control every aspect of the motherboard. Specification Basic Information Supported CPU 11th Generation Intel Core i9 processors / Intel Core i7 processors / Intel Core i5 processors 10th Generation Intel Core i9 processors / Intel Core i7 processors / Intel Core i5 processors / Intel Core i3 processors/ Intel Pentium processors / Intel Celeron processors L3 cache varies with CPU Chipset Intel B560 Express Chipset BIOS 1 x 256 Mbit flash Use of licensed AMI UEFI BIOS PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0 Form Factor Micro ATX Form Factor; 24.4cm x 24.4cm Expansion Slots PCI 1 x PCI Express x16 slot, running at x16 (PCIEX16) 1 x PCI Express x16 slot, running at x4 (PCIEX4) 1 x PCI Express x1 slot M.2 Socket 1 x M.2 connector (Socket 3, M key, type 2260/2280 PCIe 4.0 x4/x2 SSD support) (M2P_CPU) 1 x M.2 connector on the back of the motherboard (Socket 3, M key, type 2260/2280/22110 SATA and PCIe 3.0 x4/x2 SSD support) (M2A_SB) Memory Type DDR4 Slots 4 x DIMM Supported Memory 11th Generation Intel Core i9/ i7/ i5 processors: Support for DDR4 5333(O.C.)/ DDR4 5133(O.C.)/ DDR4 5000(O.C.)/ 4933(O.C.)/ 4800(O.C.)/ 4700(O.C.)/ 4600(O.C.)/ 4500(O.C.)/ 4400(O.C.)/ 4300(O.C.)/ 4266(O.C.) / 4133(O.C.) / 4000(O.C.) / 3866(O.C.) / 3800(O.C.) / 3733(O.C.) / 3666(O.C.) / 3600(O.C.) / 3466(O.C.) / 3400(O.C.) / 3333(O.C.) / 3300(O.C.) / 3200 / 3000 / 2933 / 2800 / 2666 / 2400 / 2133 MHz memory modules 10th Generation Intel Core i9/ i7 processors: Support for DDR4 2933/ 2666/ 2400/ 2133 MHz memory modules 10th Generation Intel Core i5/ i3 /Pentium/Celeron processors: Support for DDR4 2666/2400/2133 MHz memory modules Dual channel memory architecture ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode) non-ECC Un-buffered DIMM 1Rx8/ 2Rx8/ 1Rx16 memory modules Extreme Memory Profile (XMP) memory modules Maximum Memory 128 GB (32 GB single DIMM capacity) Graphics Graphics Integrated Graphics Processor-Intel® HD Graphics support: 1 x HDMI port, supporting a maximum resolution of 4096x2160@30 Hz 1 x DisplayPort, supporting a maximum resolution of 4096x2304@60 Hz Support for AMD Quad-GPU CrossFire and 2-Way AMD CrossFire technologies Connector & Ports HDMI 1 x HDMI port, supporting a maximum resolution of 4096 x 2160@30 Hz Display Port (s) 1 x DisplayPort, supporting a maximum resolution of 4096 x 2304@60 Hz USB (s) 1 x USB Type-C port on the back panel, with USB 3.2 Gen2x2 support 1 x USB 3.2 Gen2 Type-A ports (red) on the back panel 2 x USB 3.2 Gen1 ports on the back panel 2 x USB 2.0/1.1 ports on the back panel Chipset+USB 3.2 Gen 1 Hub: 1 x USB Type-C port with USB 3.2 Gen1 support, available through the internal USB header 2 x USB 3.2 Gen1 ports available through the internal USB header Chipset+ 2 USB 2.0 Hubs: 8 x USB 2.0/ 1.1 ports (4 ports on the back panel, 4 ports available through the internal USB headers) LAN Port (s) Intel 2.5GbE LAN chip (2.5 Gbit/1 Gbit/100 Mbit) Supported Storage 1 x M.2 connector (Socket 3, M key, type 2260/2280 PCIe 4.0 x4/x2 SSD support) (M2P_CPU) Chipset: 1 x M.2 connector on the back of the motherboard (Socket 3, M key, type 2260/2280/22110 SATA and PCIe 3.0 x4/x2 SSD support) (M2A_SB) 6 x SATA 6Gb/s connectors Intel Optane Memory Ready Audio Realtek Audio codec High Definition Audio 2/4/5.1/7.1-channel Internal I/O Ports 1 x 24-pin ATX main power connector 3 x system fan headers 1 x 8-pin ATX 12V power connector 2 x addressable LED strip headers 1 x CPU fan header 2 x RGB LED strip headers 1 x water cooling CPU fan header 6 x SATA 6Gb/s connectors 1 x front panel header 2 x M.2 Socket 3 connectors 1 x front panel audio header 1 x USB Type-C header, with USB 3.2 Gen 1 support 1 x USB 3.2 Gen 1 header 2 x USB 2.0/1.1 headers 1 x serial port header 2 x Thunderbolt add-in card connectors 1 x Clear CMOS jumper 1 x Q-Flash Plus button TPM (Trusted Platform Module ) 1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 module only) Warranty Information Manufacturing Warranty 3 Years Others Special Features Wireless Communication module: Intel Wi-Fi 6 AX200 Wi-Fi 802.11a/ b/ g/ n/ ac/ ax, supporting 2.4/ 5 GHz Dual-Band BLUETOOTH 5.1 Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate ..