Status
In Stock
2 listings tracked
Lowest Deal
Out of Stock
Price Range
Single price listing
Product Description
The **Cooler Master Hyper 212X** is a premium quality **CPU Cooler** designed to offer durability, high efficiency, and seamless compatibility with standard desktop PC configurations. This item is currently out of stock or unavailable at our tracked local computer stores in Bangladesh.
Part ID: #CAN-04823
Last Updated: 1 week ago
Available Deals & Price Comparison
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Product Specifications
Key Features
Type
Air Cooler
Fan Speed
600-1700 RPM
Fan Airflow
21.2 - 54.6 CFM ± 10%
Noise
13 - 28.6 dBA
Air Pressure
0.40 - 2.03 mmH2O ± 10%
Connector
4-Pin (PWM)
Material
HEAT SINK MATERIAL: Aluminum Fins, Copper (Heat Pipes)
MPN
RR-212X-17PK-R1
Model
Hyper 212X
Cooler Type
Air Cooler
Fan Air Flow
21.2 - 54.6 CFM
Fan Air Pressure
0.40 - 2.03 mmH2O
Physical Specification
Dimension
DIMENSIONS: 120 x 79 x 158 mm FAN DIMENSIONS: 120 x 120 x 25 mm HEAT SINK DIMENSIONS: 116 x 51 x 158 mm
Weight
FAN WEIGHT: 166g HEAT SINK WEIGHT: 492g
Supported Sockets
Intel
LGA2066, LGA2011-v3, LGA2011, LGA1200, LGA1156, LGA1155, LGA1151, LGA1150
AMD
AM4, AM3+, AM3, AM2+, FM2+, FM2, FM1
Warranty Information
Warranty
01 Year
Part ID: #CAN-04823
Last Updated: 1 week ago
The latest in the extremely popular Hyper 212 series, Cooler Master’s Hyper 212X is based on the same patented CDC Quad heatpipe array as the 212 EVO but features several improvements that boost performance and further reduce noise. Thanks to our brand new Smart Engine and POM bearing, the 212X is incredibly durable and will virtually last a lifetime. Positioned in a 45 degree angle and surrounding the heatpipe, each fin-blade features X-shaped vents that create areas of high and low air pressure, resulting in several controlled vortices. These small and chaotic turbulences produce strong gusts that reduce overall airflow but improve airflow where it matters the most – next to the heatpipes. Funnel shaped aluminum fins and a series of perforated dimples guide the airflow towards the heatpipes. The combination of both of these patent technologies results in notably higher airflow over the heatpipes and the adjacent fin area, which ultimately reduces CPU temperatures. The specially designed X-Vents act similar to tiny airplane wings and prevent deadspots behind and between heatpipes. The combination of these patented technologies results in a notably higher airflow over the heatpipes and the adjacent fin area, ultimately reducing CPU temperatures. 4 Continuous Direct Contact Heatpipes create a gap-less contact surface for unmatched cooling efficiency. Aluminum Fin Array with Tunnel Effect layout creates micro vortices that boost the airflow and circulate it around the heatpipes. Fast and easy to install and extremely reliable, our famous X-Bracket mounting system is compatible with all current sockets.
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